top of page

Packaging Services

PalPilot provides custom BEOL Package System solutions & services including design, SI/PI modeling, wafer bumping, substrate fabrication, package assembly/test and PoP/SiP module definition and manufacturing.  Applications include, wearable/IoT, Mobile/Hand Held, Optical/VCSEL, High Speed/Wide Bandwidth, memory and advance thermal packaging solutions.  Typical industries serviced include, Automotive, Medical, Communications, Consumer, General Industrial.

Package System Design 

Signal/Power Integrity Modeling

Package System 3D Mechanical Modeling

Packaging Assembly & Test

Industry Focused Package Systems Integration

PKG Video Draft 250127

PKG Video Draft 250127

Play Video
Package System 

PalPilot enables customer specific BEOL Packaging System solutions & services. 

Design Service

  • Design Service

SI/PI Modeling​

Wafer Process

  • Cu Pillar Plating, Grinding Dicing

Substrate Fabrication

  • FCBGA (Small & High Volume)

Package Assembly

  • 40um Pitch

Advanced Packaging System

  • TSV + Multi Layer RDL

RoadMap1.png
Package System Design 

Custom Package System design including substrate selection/routing, package assembly structure definition (PoP, SiP, single die, etc.) meeting industry specific DFM & reliability requirements (Deliverables: 2D DXF & Various Design Files).

Signal/Power Integrity Modeling

PCB & Package system, passive interconnect, electrical signal & power modeling (Deliverables: SI/PI Report & Program Files).

SIPI_image.png

PalPilot’s substrate division delivers full interconnect solutions from SI/PI modeling, interconnect routing & fabrication. 

 

  • Full Package Modeling & Design Service

  • 5 & 7 Day BGA/CSP Quick Turn Fabrication

  • Ultra-Thin “Coreless” Package Structures

  • Ceramic On Organic Laminate (COOL) Package Product Launch

  • Full Package SiP Product Solutions

SIPI_image.png
Package System 3D Mechanical Modeling

Package System 3D mechanical design (Deliverables: 3D STEP Files).

Packaging Assembly & Test
(Product Fabrication/Manufacturing)

Substrate fabrication integrated with package assembly/test (Deliverable: Fully tested packaged components).

SIPI_image.png

Going beyond PCB, PalPilot offers packaging services to give the full spectrum from 0 to unlimited.

Substrate-Package-Structures.png
Industry Focused Package Systems Integration

B2B Package Systems, technology & supply program management/development from NPI, production ramp, to high volume manufacturing of high power, high speed package systems showing calculated improvement of customer’s corporate ROA components (Deliverable: A calculated improvement of customers ROA components including impact on Revenue, SG&A, COGS, Fix/Current Asset).

GET IN TOUCH
We'd love to hear from you!
follow us
  • White LinkedIn Icon
  • White Facebook Icon
  • White Instagram Icon
PalPilot_New Logo_100W.png

“Pal” embodies the value of strong customer and partner relationship and recognition; “Pilot” demonstrates our forward drive as a supply and demand solution leader.

Northern California Office 

(408) 855-8866

contact@palpilot.com

500 Yosemite Drive, Milpitas, CA 95035

Southern California Office 

(714) 460-0718

contact@palpilot.com

15991 Red Hill Ave. Suite 102 Tustin CA 92780

  • PalPilot LinkedIn
  • PalPilot Facebook Icon
  • PalPilot Instagram Icon

INFORMATION SECURITY POLICY

 

Vision and Goals

1. Information Security Policy: To enhance information security management, ensuring the confidentiality, integrity, and availability of associated information and information assets. This aims to provide an information environment that supports the continuous operation of the company’s information business and complies with relevant regulatory requirements, safeguarding against intentional or accidental threats from both internal and external sources.

2. Information Security Objectives:

1. To conduct information security education and training, prompting awareness of information security among personnel and enhancing their understanding of related responsibilities.

2. To protect the information related to the Company’s business activities, preventing unauthorized access and modification, and ensuring its accuracy and completeness.

3. To ensure that the execution of the Company’s business activities complies with relevant legal and regulatory requirements.

4. To implement an information security risk assessment mechanism, enhancing the effectiveness and timeliness of information security management.

5. To conduct regular internal audits of information security operations, ensuring that related activities are properly implemented.

6. To maintain the continuous operation of information systems, ensuring that the Company has an information environment suitable for ongoing business operations.

 

An annual action plan should be developed based on the above information security objectives, detailing the required resources, responsible personnel, estimated completion time, and methods for evaluating results and assessment outcomes. Relevant monitoring and measurement activities should be conducted in accordance with the Company’s “ Control Implementation Effectiveness Measurement Form”.

© 2025 PalPilot International Corp. All rights reserved. Designed by LIMVI Studio. | Privacy Policy | Terms & Conditions | Accessibility Statement

bottom of page