![](https://static.wixstatic.com/media/eaa617_24a43b9e64094922b50e5d692f88776c~mv2_d_6720_2240_s_2.jpg/v1/fill/w_147,h_49,al_c,q_80,usm_0.66_1.00_0.01,blur_2,enc_auto/eaa617_24a43b9e64094922b50e5d692f88776c~mv2_d_6720_2240_s_2.jpg)
Packaging Services
PalPilot provides custom BEOL Package System solutions & services including design, SI/PI modeling, wafer bumping, substrate fabrication, package assembly/test and PoP/SiP module definition and manufacturing. Applications include, wearable/IoT, Mobile/Hand Held, Optical/VCSEL, High Speed/Wide Bandwidth, memory and advance thermal packaging solutions. Typical industries serviced include, Automotive, Medical, Communications, Consumer, General Industrial.
Package System Design
Signal/Power Integrity Modeling
Package System 3D Mechanical Modeling
Packaging Assembly & Test
Industry Focused Package Systems Integration
![RoadMap1.png](https://static.wixstatic.com/media/eaa617_9030de18945b41ba82598ce3a230f61d~mv2.png/v1/crop/x_56,y_64,w_875,h_571/fill/w_124,h_81,al_c,q_85,usm_0.66_1.00_0.01,blur_2,enc_auto/RoadMap1.png)
Package System Design
Custom Package System design including substrate selection/routing, package assembly structure definition (PoP, SiP, single die, etc.) meeting industry specific DFM & reliability requirements (Deliverables: 2D DXF & Various Design Files).
Signal/Power Integrity Modeling
PCB & Package system, passive interconnect, electrical signal & power modeling (Deliverables: SI/PI Report & Program Files).
![SIPI_image.png](https://static.wixstatic.com/media/eaa617_de383681bbf14202963de6e37ac0b240~mv2.png/v1/crop/x_1,y_0,w_331,h_265/fill/w_94,h_75,al_c,q_85,usm_0.66_1.00_0.01,blur_2,enc_auto/SIPI_image.png)
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PalPilot’s substrate division delivers full interconnect solutions from SI/PI modeling, interconnect routing & fabrication.
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Full Package Modeling & Design Service
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5 & 7 Day BGA/CSP Quick Turn Fabrication
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Ultra-Thin “Coreless” Package Structures
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Ceramic On Organic Laminate (COOL) Package Product Launch
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Full Package SiP Product Solutions
![SIPI_image.png](https://static.wixstatic.com/media/eaa617_de383681bbf14202963de6e37ac0b240~mv2.png/v1/crop/x_381,y_0,w_243,h_265/fill/w_73,h_80,al_c,q_85,usm_0.66_1.00_0.01,blur_2,enc_auto/SIPI_image.png)
Package System 3D Mechanical Modeling
Package System 3D mechanical design (Deliverables: 3D STEP Files).
Packaging Assembly & Test
(Product Fabrication/Manufacturing)
Substrate fabrication integrated with package assembly/test (Deliverable: Fully tested packaged components).
![SIPI_image.png](https://static.wixstatic.com/media/eaa617_de383681bbf14202963de6e37ac0b240~mv2.png/v1/crop/x_735,y_52,w_218,h_173/fill/w_100,h_79,al_c,q_85,usm_0.66_1.00_0.01,blur_2,enc_auto/SIPI_image.png)
![Substrate-Package-Structures.png](https://static.wixstatic.com/media/eaa617_52f2c87b644f47f6b24cdaa565796900~mv2.png/v1/fill/w_120,h_80,al_c,q_85,usm_0.66_1.00_0.01,blur_2,enc_auto/Substrate-Package-Structures.png)
Industry Focused Package Systems Integration
B2B Package Systems, technology & supply program management/development from NPI, production ramp, to high volume manufacturing of high power, high speed package systems showing calculated improvement of customer’s corporate ROA components (Deliverable: A calculated improvement of customers ROA components including impact on Revenue, SG&A, COGS, Fix/Current Asset).